Project description:

    Much background interference and low contrast of defect gray level exist in this detection. The AI solution proposed by DSTEK based on Handdle AI deep learning algorithm and AI technology can greatly improve production efficiency and detection accuracy, as well as reduce costs while increasing efficiency for manufacturers.

   Defect types:

    Broken gate, electric leakage, black chips, edge absence, cracked chips (including tiny hidden cracks, cross hidden cracks, arc cracks, through-chip cracks, explosion cracks), incomplete solder and short circuit.

                                                                                                               Original picture                                                                                                                         Detection picture

   AI overall intelligent detection      Standardized software and hardware products + customized development         Intelligent image analysis technology