More and more miniaturized and complex electronic components of laptops, mobile phones and other electronic products have put forward higher requirements for the precision, accuracy and efficiency of industrial quality detection, but the traditional detection methods can't meet the high standards
The solutions DSTEK worked out on the basis of Handdle AI intelligent algorithm platform take the machine vision technology and industry accumulative experience as the underlying architecture to quickly and accurately implement the overall detection of 3C product defects, thus improving the detection efficiency and accuracy.