Project description:

    Combined with 2D and 3D solutions, DSTEK detects the defects of polycrystalline silicon solar cell chip modules by virtue of deep learning algorithm based on Handdle AI, AI camera, and the infrared images of cell chips collected through EL phenomena, so as to achieve automatic classification and location of internal defects.

 Defect types:

         Broken gate, electric leakage, black chips, edge absence, cracked chips (including tiny hidden cracks, cross hidden cracks, arc cracks, through-chip cracks, explosion cracks, etc.), incomplete solder and short circuit.

                                                                                          Original picture                                                                                                                                                         Detection picture

      AI overall intelligent detection          Standardized software and hardware products + customized development             Continuous optimization of model