Project description:

    With Handdle AI algorithm platform and the supporting software and hardware of AI camera, DSTEK can quickly and accurately detect tiny damages online, such as black chips, hidden cracks and perforations after the adjustment and optimization of algorithms. The early removal of these silicon chips is important to improve the quality of subsequent process and reduce the waste of subsequent process.

   Defect types:

   Black chips, hidden cracks, incomplete solder, black edge, black spots, cracked chips, etc.

                                                                                                       Original picture                                                                                                                      Detection picture

               Standardized software and hardware products + customized development                        Overall intelligent detection and a 35% cost reduction