Project description:
The difficulties of this item are the small difference, similar shape and much interference in the contrast between the defect area and background area. DSTEK proposes a chip defect detection solution based on Handdle AI algorithm platform, which can identify defects, including contaminant particles, surface scratches, crystal originated pits and bulges on the wafer surface.
![](http://hkwd63029.pic9.websiteonline.cn/upload/j0sx.png)
Defect types:
Dirt, pitting, damage, edge absence, foreign matter, original absence, malposition, scratches; location, measurement, counting, etc.
![](http://hkwd63029.pic9.websiteonline.cn/upload/1-0.png)
Overall intelligent detection
Product standardization and low freely built threshold
Intelligent image analysis technology