Project description:

    The difficulties of this item are the small difference, similar shape and much interference in the contrast between the defect area and background area. DSTEK proposes a chip defect detection solution based on Handdle AI algorithm platform, which can identify defects, including contaminant particles, surface scratches, crystal originated pits and bulges on the wafer surface.

   Defect types:

    Dirt, pitting, damage, edge absence, foreign matter, original absence, malposition, scratches; location, measurement, counting, etc.

                   Overall intelligent detection       Product standardization and low freely built threshold       Intelligent image analysis technology